发布于 2026-10-13
英文原文
SPS(智能功率级)工艺工程师(WET/集成/金属沉积/光刻)
Mid-end and backend process technology (WET/Integration/Metal deposition/Lithography engineer)
ルネサス エレクトロニクス
| 职种 | 工程 |
雇用形态 | — |
| 工作地点 | Saijo, Ehime, jp |
薪资 | 面议 |
职位概要
SPS(智能功率级)产品预计2025至2030年需求大幅增长,尤其是AI服务器需求激增。嵌入式VPS(如PT功率塔模块和VPS垂直功率级)需要Cu-RDL、背面金属、硅超薄化等中段工艺,有助于与竞争对手差异化。瑞萨正在加强内部制造,计划开发这些中段工艺技术,通过内部生产确保产能并缩短交付周期,客户也强烈要求内部生产。未来,芯粒技术将越来越需要RDL和凸块等中段工艺。本次招聘理解功率器件结构和特性、能够构建从RDL和OPM等中段工艺到背面工艺和切割的最佳工艺的人才。通过获得精通中段和背面工艺的人才,不仅可开发内部工艺,还能应对OSAT的问题。招聘以下四个领域的工艺工程师:①WET工艺工程师:推动新产品中段和后段WET工艺开发,技术支持与报告,支持产线启动和量产过渡,推动质量和良率提升活动,支持WET相关新材料和新制造方法的技术开发,支持传统WET工艺的成本降低活动。②集成工程师:推动新产品中段和后段工艺开发,技术支持与报告,支持产线启动和量产过渡,推动质量和良率提升活动,支持新材料和新制造开发的技术开发,支持传统工艺的成本降低活动。③金属沉积工程师:推动新产品中段和后段金属沉积工艺开发,技术支持与报告,支持产线启动和量产过渡,推动质量和良率提升活动,支持金属沉积相关新材料和新制造方法的技术开发,支持传统金属沉积工艺的成本降低活动。④光刻工程师:推动新产品中段和后段光刻工艺开发,技术支持与报告,支持产线启动和量产过渡,推动质量和良率提升活动,支持光刻相关新材料和新制造方法的技术开发,支持传统光刻相关工艺的成本降低活动。任职资格:①WET工艺工程师:要求2年以上WET工艺开发或量产经验,WET相关材料开发或评估经验,WET相关设备开发或评估经验,工程学位(机械、材料、电子、化学等)。优先:功率器件基础知识,可靠性测试评估知识,工艺改进和质量控制实践经验,ISO/IATF等质量标准合规经验。②集成工程师:要求2年以上金属化后半导体集成开发经验,功率器件基础知识,可靠性测试评估知识,工艺改进和质量控制实践经验,工程学位。优先:半导体封装开发经验,晶圆工艺技术启动开发经验,ISO/IATF等质量标准合规经验。③金属沉积工程师:要求2年以上半导体金属沉积工艺开发或量产经验,金属沉积相关材料开发或评估经验,金属沉积相关设备开发或评估经验,工程学位。优先:功率器件基础知识,可靠性测试评估知识,工艺改进和质量控制实践经验,ISO/IATF等质量标准合规经验。④光刻工程师:要求2年以上半导体光刻技术开发或量产经验,光刻相关材料开发或评估经验,光刻相关设备开发或评估经验,工程学位。优先:功率器件基础知识,可靠性测试评估知识,工艺改进和质量控制实践经验,ISO/IATF等质量标准合规经验。瑞萨以“让我们的生活更轻松”为宗旨,提供嵌入式半导体解决方案的全球企业。在30多个国家拥有超过21,000名工程师和问题解决专家,参与汽车、工业、基础设施和物联网领域的世界尖端技术开发,致力于实现更安全、健康、环保和智能的未来。瑞萨以“TAGIE(透明、敏捷、全球、创新、创业)”为核心企业文化。
职位描述
Job Description SPS (Smart Power Stage) products are expected to see significant demand growth from 2025 to 2030, with a particular surge in demand for AI servers. These devices, especially embedded VPS such as PT (Power Tower Module) and VPS (Vertical Power Stage), require Mid-end processes such as Cu-RDL, backside metal, and ultra-thinning of Si, which also help differentiate from competitors. Renesas is strengthening in-house manufacturing, and as part of this, we plan to develop technologies for these Mid-end processes, secure production capacity and shorten LT through in-house production. These in-house productions are also strongly requested by customers. Going forward, chiplet technology that maximizes performance while reducing manufacturing costs and shortening development periods will increasingly require Mid-end processes such as RDL and bumps. This time, we are recruiting personnel who understand the structure and characteristics of power devices and can build optimal processes from Mid-end processes such as RDL and OPM to back-side processes and dicing, as we internalize embedded VPS. By acquiring personnel well-versed in Mid-end and backside processes, it becomes possible not only to develop internal processes but also to respond to issues in OSAT. We are seeking process engineers in the following four areas: 【Roles and Responsibilities】 ①WET process engineer Promotion of WET process development for Mid-end and backend processes of new products Technical responses and reporting based on WET process development Support for manufacturing line startup and mass production transition Promotion of product quality and yield improvement activities Support for technology development of new materials and new manufacturing methods related to WET process Support for cost reduction activities in traditional WET processes ②Integration engineer Promoting process development for Mid-end and backend processing of new products Technical responses and reporting based on process development Support for manufacturing line startup and mass production transition Promotion of product quality and yield improvement activities Support for technology development of new materials and new manufacture development Support for cost reduction activities in conventional processes ③Metal deposition engineer Promotion of metal deposition process development for intermediate and backend processes of new products Technical responses and reporting based on metal deposition process development Support for manufacturing line startup and mass production transition Promotion of product quality and yield improvement activities Support for technology development of new materials and new manufacturing methods related to metal deposition process Support for cost reduction activities in traditional metal deposition processes ④Lithography engineer Promotion of lithography process development for Mid-end and backend processing of new products Technical responses and reporting based on lithography process development Support for manufacturing line startup and mass production transition Promotion of product quality and yield improvement activities Support for technology development of new materials and new manufacturing methods related to lithography Support for cost reduction activities in traditional lithography-related processes Qualifications ①WET process engineer Required: Over 2 years of experience in WET process development or mass production Experience in developing or evaluating WET process-related materials Experience in developing or evaluating WET process-related equipment Degree in engineering (mechanical, materials, electronics, chemistry, etc.) Preferred: Basic knowledge of power devices Knowledge of reliability testing evaluation Practical experience in process improvement and quality control Experience in complying with quality standards such as ISO/IATF ②Integration engineer Required: Over 2 years of experience in semiconductor integration development after metallization Basic knowledge of power devices Knowledge of reliability testing evaluation Practical experience in process improvement and quality control Degree in engineering (mechanical, materials, electronics, chemistry, etc.) Preferred: Experience in semiconductor package development Development experience in wafer process technology startup Experience in complying with quality standards such as ISO/IATF ③Metal deposition engineer Required: Over 2 years of experience in semiconductor metal deposition process development or mass production Experience in developing or evaluating metal deposition-related materials Experience in developing or evaluating metal deposition-related equipment Degree in engineering (mechanical, materials, electronics, chemistry, etc.) Preferred: Basic knowledge of power devices Knowledge of reliability testing evaluation Practical experience in process improvement and quality control Experience in complying with quality standards such as ISO/IATF ④Lithography engineer Required: Over 2 years of experience in semiconductor lithography technology development or mass production Experience in developing or evaluating lithography-related materials Experience in developing or evaluating lithography-related equipment Degree in engineering (mechanical, materials, electronics, chemistry, etc.) Preferred: Basic knowledge of power devices Knowledge of reliability testing evaluation Practical experience in process improvement and quality control Experience in complying with quality standards such as ISO/IATF Additional Information ルネサスは、「To Make Our Lives Easier(人々の暮らしをより豊かで快適にする)」というPurposeのもと、組込み半導体ソリューションを提供するグローバル企業です。世界30か国以上で活躍する21,000人を超えるエンジニアや課題解決のプロフェッショナルとともに、自動車、産業、インフラ、IoT分野における世界最先端のテクノロジー開発に携わり、より安全で、健康的で、環境にやさしく、スマートな未来の実現に貢献しています。 ルネサスでは、「TAGIE(Transparent、Agile、Global、Innovative、Entrepreneurial)」を企業文化の中核としています。TAGIEは、私たちの働き方や成長のあり方、そしてPurposeの実現に向けた取り組みを支える共通の価値観です。この協調的な精神と挑戦するマインドセットが、半導体技術を通じた産業の変革と、世界中の人々の暮らしへの貢献を可能にしています。 私たちは、競争力のある報酬制度に加え、充実した福利厚生をご用意しています。福利厚生の詳細については、選考プロセスの中でご案内いたします。 私たちとともに未来を創造する挑戦に、ぜひ参加しませんか。皆さまからのご応募をお待ちしております。