客户产品保证工程师

Job Description Renesas is seeking a Customer Product Assurance Engineer to serve as the primary quality and reliability interface between Renesas and its key AI datacenter customers for the AI High Density Power (HDP) Modules product families. These products push the technology limits of speed, density, and efficiency to deliver power to the world's highest-performance AI processors and computing infrastructure. This is a customer-facing, cross-functional role sitting at the intersection of customer quality management, product reliability engineering, and supplier quality. The individual will work directly with AI hyperscaler and datacenter customers to ensure smooth new product ramps, rapid resolution of field quality issues, and the highest levels of product assurance throughout the product lifecycle. The role reports to the Product Assurance Director and partners closely with the Quality & Reliability Design Engineer and the Supplier Quality Engineer to deliver a seamless quality experience from component sourcing through customer deployment. Key Responsibilities Customer Engagement & New Product Ramps • Serve as the primary quality liaison to key AI datacenter and hyperscaler customers, building trusted relationships with their QA and qualification teams. • Lead and coordinate customer qualification activities for new AI power module products, ensuring ramp readiness by meeting customer-specific qualification requirements, timelines, and acceptance criteria. • Communicate proactively and transparently with customers throughout the product development and qualification lifecycle, managing expectations and resolving issues at pace. • Translate customer quality requirements and feedback into actionable inputs for internal design, reliability, and supplier quality teams. Issue Management & Escalation Resolution • Own the end-to-end resolution of customer quality escalations, coordinating cross-functional teams to swiftly identify, contain, and correct issues using structured methodologies including 8D, Six Sigma, and Root Cause Analysis (RCA). • Manage field returns and customer complaints; analyze return data to identify trends, systemic root causes, and corrective action opportunities. • Drive closure of corrective and preventive actions (CAPA), ensuring solutions are robust and verified before communicating resolution to customers. • Provide regular quality performance reporting to both internal stakeholders and customers, including defect rate trends, return analysis, and improvement roadmaps. Collaboration with Quality & Reliability Engineering • Partner closely with the Quality & Reliability Design Engineer to align customer qualification test requirements with internal reliability and qualification test programs. • Leverage reliability data, qualification reports, and DfR (Design for Reliability) outputs to provide customers with confidence in product performance and longevity. • Collaborate on root cause investigations for field failures, drawing on internal reliability test data, failure analysis results, and design knowledge. • Support development of customer-facing quality documentation including qualification summary reports, reliability data packages, and ATE data summaries. Collaboration with Supplier Quality Engineering • Work with the Supplier Quality Engineer to ensure component and PCBA quality issues identified by customers are traced back to the supply chain and addressed at the source. • Coordinate with supplier quality on incoming material quality data, FMEA reviews, and corrective actions when supplier-related issues surface in customer environments. • Ensure customer-facing quality commitments are supported by robust supplier quality controls and documentation. Design for Quality & Continuous Improvement • Champion "design for quality" principles within the product team, integrating customer quality requirements into design, process, and test decisions from the earliest development stages. • Identify and drive continuous improvement initiatives that reduce defect rates, improve manufacturing yield, and enhance product consistency. • Support development and review of FMEAs, control plans, and process qualification documentation to proactively identify and mitigate quality risks before customer impact. Qualifications • Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related field. Education: • 7–12+ years of experience in the semiconductor or power electronics industry, with direct customer-facing quality or applications engineering experience. Experience: • Demonstrated ability to manage customer relationships in a quality or technical role, including leading qualification activities, handling escalations, and presenting technical data to customer engineering and procurement teams. Customer Interface: • Hands-on experience qualifying power modules, power semiconductors, or PCB assemblies, ideally for AI, datacenter, or high-performance computing applications. Power Modules / Semiconductors: • Proficiency with 8D, Root Cause Analysis, Six Sigma, or equivalent methodologies for issue containment and corrective action. Structured Problem Solving: • Familiarity with Design for Reliability (DfR) principles, qualification test methods (e.g., HTOL, PCT, TC), and reliability data interpretation. Reliability Engineering: • Working knowledge of PCB assembly processes including surface mount technology (SMT), component selection, and manufacturing quality controls. PCBA & Manufacturing Knowledge: • Experience with FMEAs, Cpk/SPC, CAPA processes, and supplier or process audits. Quality Tools: • Ability to analyze and communicate quality metrics—defect rates, yield trends, return data—clearly to both technical and executive audiences. Data-Driven Communication: • Excellent written and verbal communication skills; demonstrated ability to lead cross-functional teams and influence without direct authority. Communication & Collaboration: Preferred Qualifications • Experience supporting AI hyperscaler or cloud datacenter customer qualifications for power delivery products. • Familiarity with automotive or commercial quality standards (AEC-Q100, AEC-Q200, ISO 9001, IATF 16949) and their application to high-reliability electronics. • Knowledge of failure analysis techniques (SEM/EDX, cross-section, thermal imaging) used in root cause investigations. • Experience with statistical process control (SPC) and data analysis tools. Additional Information Why Join Renesas The Performance Computing Power business is one of Renesas' fastest-growing and most strategically important product lines, sitting at the center of the global AI infrastructure buildout. In this role, you will work directly with leading AI companies and have a measurable impact on the quality and reliability of products that power the world's most advanced AI systems. You will join a high-caliber, collaborative team with deep expertise across power electronics, reliability, and quality engineering. Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed