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发布于 2026-09-14 英文原文

工艺工程师 - 半导体后段封装

Process Engineer

ルネサス エレクトロニクス

职种工程 雇用形态—
工作地点Bayan Lepas, my 薪资面议

职位概要

招聘工艺工程师,需至少2年半导体后段封装工艺实操经验,尤其熟悉芯片粘接(die bonding)和引线键合(wire bonding)。主要职责包括:开发、优化并维持芯片粘接与引线键合工艺以满足质量、良率与可靠性要求;进行工艺故障排查及良率损失、缺陷、设备问题的根本原因分析;支持新产品导入(NPI)、工艺认证及量产转移;建立并维护工艺参数、作业指导书与控制计划;使用统计方法(如SPC、CPK、趋势分析)分析工艺数据;与生产、质量、设备及研发等跨职能团队协作;推动成本、良率、周期时间与可靠性的持续改进。任职资格:工程类学士学位(材料、机械或相关专业);至少2年半导体后段封装经验;扎实的芯片粘接与引线键合工艺知识;熟悉引线框架、基板、粘合剂、键合线等后段材料;具备工艺表征、DOE与数据分析经验者优先;良好的问题解决、沟通与团队合作能力。加分项:QFN或类似封装经验、良率提升/可靠性测试/失效分析知识、自动化与设备调试及工艺优化经验。Renesas为嵌入式半导体解决方案供应商,全球30多个国家拥有逾21000名工程师,文化核心为TAGIE(透明、敏捷、全球、创新、创业),提供有竞争力的薪酬福利,为平等机会雇主。

职位描述

Job Description We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes , particularly die bonding and wire bonding . The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance. The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations. Key Responsibilities Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues Support new product introduction (NPI), process qualification, and transfer to mass production Establish and maintain process parameters, work instructions, and control plans Analyze process data using statistical methods (e.g. SPC, CPK, trend analysis) Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D Drive continuous improvement activities for cost, yield, cycle time, and reliability Qualifications Bachelor’s degree in Engineering (Materials, Mechanical, or related field) Minimum 2 years of experience in semiconductor back-end assembly Strong knowledge of die bonding and wire bonding processes Familiarity with back-end materials such as leadframes, substrates, adhesives, and bonding wires Experience with process characterization, DOE, and data analysis is an advantage Good problem-solving, communication, and teamwork skills. Additional Advantage: Experience with QFN, or similar packages is added advantage. Knowledge of yield improvement, reliability testing, and failure analysis Exposure to automation, equipment setup, and process optimization Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .