封装开发、新产品导入与组装工程高级总监

Job Description The Sr. Director, will lead organization responsible for driving execution of packaging development, new product introduction and assembly engineering continuous improvement. This leader will partner closely with Package Design and Development Engineering Directors, product group partners—especially Design, Application, and Marketing teams—Product, Reliability, Quality, Operations, Supply Chain, and key OSAT/CM partners to ensure programs meet committed schedules, quality and reliability objectives, production readiness requirements and long term continuous improvement of packaging products. The role will establish strong program governance, identify and escalate critical risks early, and lead cross-functional technical task forces to resolve development challenges that threaten quality, reliability, yield, manufacturability, or schedule. Additionally, the role will closely monitor operations at our key OSAT partners, ensuring consistent execution, effective issue escalation, and tight alignment between Renesas development teams and external assembly partners. Responsibilities: Recruit, build and mentor a new team of Packaging engineers. Partner with Package Engineering Directors who lead technical package development programs, providing program-level execution leadership, governance, and accountability. Establish and drive end-to-end NPI program plans, milestones, critical paths, resource alignment, risk management, and executive reporting to ensure committed schedules are achieved. Create a disciplined program management operating model covering development, qualification, customer requirements, production readiness, ramp, and transition to volume manufacturing. Proactively identify technical, quality, reliability, supply, manufacturing, and schedule risks; establish mitigation plans and escalate critical issues with clear recommendations and decision points. Lead cross-functional technical task forces for major development challenges, particularly issues affecting quality, reliability, yield, manufacturability, qualification, or NPI schedule. Drive structured problem solving and closure of critical issues using data-driven methods, root-cause analysis, risk assessment, and clearly defined corrective/preventive actions. Coordinate closely with Package Engineering, product group partners—especially Design, Application, and Marketing teams—Product Engineering, Reliability, Quality, Operations, Supply Chain, and other functional leaders to remove execution barriers and maintain program momentum. Establish program dashboards and management systems that provide transparent visibility to milestones, critical path activities, risks, issues, action owners, and recovery plans. Lead technical program management activities with key OSAT/CM partners, including program reviews, milestone tracking, issue escalation, recovery plans, qualification readiness, and production ramp execution. Ensure execution of Engineering Build Requests (EBRs) per committed schedule at each OSAT, regularly tracking overall EBR progress, identifying delays, and driving timely recovery actions. Develop and lead package and assembly teams located at strategic OSATs, ensuring alignment with Renesas priorities, technical teams, and global NPI schedules. Ensure OSAT/CM development activities, DOE, process optimization, qualification, process-window verification, production controls, and ramp readiness are aligned with overall NPI program objectives. Drive timely resolution of process integration and assembly issues that could impact product quality, reliability, qualification, yield, or customer commitments. Ensure effective transition from development and qualification into production, including readiness reviews, ramp monitoring, issue management, and sustained execution. Establish standardized program management processes, templates, metrics, escalation mechanisms, and lessons-learned practices across the global organization. Provide concise, fact-based executive communication on program health, critical risks, schedule recovery, resource needs, and decisions required from senior leadership. Build strong relationships with OSAT/CM executive and technical leadership to improve responsiveness, accountability, and execution of critical AI/Datacenter Power programs. Develop the technical and leadership capabilities of the TPM organization and establish a high-performance, execution-focused culture. Support package technology roadmap execution by translating strategic technology priorities into executable development programs, milestones, resources, and deliverables. Address internal and external customer-impacting issues in partnership with Marketing, Product, Quality, Operations, and Package Engineering organizations. LEADERSHIP & ORGANIZATIONAL RESPONSIBILITIES Recruit, build and mentor a new team of Packaging engineers. Lead and develop a team of Package and assembly engineers supporting multiple package types and business groups Set organizational priorities, staffing strategy, performance expectations, and development plans aligned with business growth. Establish clear accountability between Package Development Engineering, NPI Engineering, OSAT engineering technical leaders while avoiding duplication of technical ownership. Create a culture of urgency, fact-based decision making, cross-functional collaboration, ownership, and rapid issue resolution. Drive consistent execution standards across internal teams and strategic OSAT locations. Qualifications Location Commitment: Willingness and ability to relocate to / be based in India for a 2-year project assignment. Doctorate, Master’s, or Bachelor’s Degree in Electrical Engineering, Materials Science, Electrical Engineering, Physics, Chemistry, or a related technical discipline. 15–20+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field. Demonstrated experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp. Strong understanding of semiconductor product development process, package and assembly processes. Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations. Proven track record leading cross-functional technical task forces and resolving complex issues involving quality, reliability, yield, manufacturability, and schedule. Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies. Exceptional program management skills, including critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment. Strong interpersonal, communication, negotiation, and executive presentation skills. Ability to influence senior technical and business leaders without direct authority and drive accountability across organizational boundaries. Experience building and leading global teams, including teams in product groups, embedded at external manufacturing or OSAT locations. Strong analytical skills and ability to translate complex technical issues into clear business impact, decisions, and actions. PREFERRED QUALIFICATIONS Experience supporting high-growth customer programs. Experience with formal technical program management methodologies and portfolio-level governance. Experience driving customer-critical NPI programs in a fast-paced, high-growth environment. SUCCESS MEASURES On-time achievement of NPI milestones and customer commitments. Reduction in schedule delays caused by unresolved technical, quality, reliability, or manufacturing issues. Timely closure of critical cross-functional task-force actions. Improved qualification, yield, reliability, and production-readines