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发布于 2026-10-28 英文原文

工作负载与性能分析、软硬件优化与协同设计及SoC架构负责人

Senior Director, Central Engineering – SoC Design & Modeling Methodologies

ルネサス エレクトロニクス

职种工程 雇用形态—
工作地点San Jose, CALIFORNIA, us 薪资面议

职位概要

该职位将担任工作负载与性能分析、软硬件(HW/SW)优化与协同设计(包括AI工作负载)以及SoC架构的负责人。要求具备架构、设计、验证、软硬件优化与协同设计方面的专业知识。具备平台设计经验以及将客户需求转化为系统级需求的能力者优先。职责涵盖工作负载表征、解决方案集成、性能与功耗权衡、先进SoC架构开发、建模方法学以及跨多条产品线的设计赋能策略。理想候选人应为公认的技术领导者,在工作负载与性能分析、AI工作负载、软硬件协同设计和SoC架构方面拥有深厚专业知识。您将与产品团队、平台团队和高层领导合作,定义和分析产品与SoC的性能及工作负载,并利用加速创新、支持组织内复用的下一代设计方法学协助协同优化。关键职责包括:制定并推动公司范围内IP和产品的工作负载分析与性能战略路线图;主导复杂IP/SoC及子系统开发的架构性能评审和技术方向;建立软硬件协同设计和基于模型的开发最佳实践;为跨架构、设计、验证、仿真和软件的跨职能团队提供技术领导。定义并分析AI工作负载及其所需性能。建设并领导高绩效工程团队,指导总监、首席工程师和杰出工程师,促进中央工程、产品团队和外部合作伙伴之间的协作,影响长期半导体技术和平台战略。任职资格:电气工程、计算机工程、计算机科学或相关技术学科硕士或博士学位(博士优先)。15年以上半导体或SoC开发经验,8年以上技术领导经验。具有领导性能与工作负载分析及软硬件协同优化的经验。技术技能:深入理解性能分析、工作负载分析、AI工作负载、SoC架构与集成、数字设计方法学、IP与子系统开发、软硬件协同设计、SoC验证方法学;具备性能与工作负载基准测试、虚拟平台与可执行规范、SoC性能建模、设计与验证自动化流程的实操经验。Renesas是嵌入式半导体解决方案提供商,以“让生活更轻松”为宗旨,在全球30多个国家拥有超过21,000名工程师,提供汽车、工业、基础设施和IoT领域的世界领先技术。TAGIE文化:透明、敏捷、全球、创新和创业精神。提供具有竞争力的薪酬福利。Renesas是平等机会和平权行动雇主,致力于支持多样性,营造无歧视的工作环境。Renesas处理受美国出口管制法规约束的两用技术,可能需要获得美国政府出口许可证。

职位描述

Job Description This position will serve as the leader of workload and performance analysis, hardware/software (HW/SW) optimization and co-design (including AI workloads), and SoC architecture. Expertise in architecture, design, validation, HW/SW optimization, and co-design is required. Experience in platform design and translating customer-facing requirements into system-level requirements is highly desirable. The role encompasses workload characterization, solution integration, performance and power tradeoffs, the development of advanced SoC architecture, modeling methodologies, and design enablement strategies across multiple product lines. The ideal candidate is a recognized technical leader with deep expertise in workload and performance analysis, AI workloads, HW/SW co-design, and SoC architecture. You will partner with product groups, platform teams, and executive leadership to define and analyze products and SoCs for performance and workload analysis, and help co-optimize using next-generation design methodologies that accelerate innovation and enable reuse across the organization. Key Responsibilities Technical Leadership Define and drive the strategic roadmap for workload analysis and performance for both IPs and products across the company. Lead architecture performance reviews and technical direction for complex IP/SoC and subsystem developments. Establish best practices for hardware/software co-design and model-based development. Provide technical leadership for cross-functional teams spanning architecture, design, verification, emulation, and software. AI-Driven Engineering Innovation Define and analyze AI workloads and the performance required for these workloads. Organizational Leadership Build and lead high-performing engineering teams. Mentor directors, principal engineers, and distinguished engineers. Foster collaboration across Central Engineering, Product Groups, and external partners. Influence long-term semiconductor technology and platform strategy. Qualifications Education MS or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or a related technical discipline (Ph.D. highly desired). Experience 15+ years of experience in semiconductor or SoC development. 8+ years of technical leadership experience. Proven experience leading performance and workload analysis and HW/SW co-optimization. Technical Skills Strong understanding of: Performance analysis Workload analysis AI workloads SoC architecture and integration Digital design methodologies IP and subsystem development Hardware/software co-design SoC verification methodologies Hands-on experience with: Performance and workload benchmarking Virtual platforms and executable specifications SoC performance modeling Design and verification automation flows Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement . Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.