IC封装设计工程师

Company Description We are seeking a highly experienced IC Package Design Engineer with extensive expertise across a broad range of semiconductor package types. The ideal candidate is proficient in industry-standard package design tools and possesses a strong understanding of package structures, performance, and manufacturability. Experience with electrical modeling and simulation tools is highly desirable. Success in this role requires strong communication and collaboration skills, as well as the ability to work effectively within a global cross-functional engineering team. Job Description 1. Design IC semiconductor packages, including WLCSP, BGA, FCCSP, SiP, QFN/DFN, and leaded leadframe-based packages (SOP, T/M/V/SSOP, QFP, PDIP, SOT23), to meet manufacturing and reliability requirements. 2. Create package layouts using Cadence APD/SiP and AutoCAD in compliance with company standards and design rules. 3. Collaborate with cross-functional teams including Product Group, Package Development, Package Documentation, Package Simulation, IC Layout Design, Analog/RF/Digital Design, Assembly Engineering, Project Management and OSATs to ensure successful package execution. 4. Drive package design activities from concept and feasibility through production, providing technical solutions and resolving design challenges. 5. Optimize package designs to meet electrical, mechanical, thermal, and manufacturability requirements. Qualifications Must-Have Qualifications: Degree (Bachelor’s, Master’s, or PhD) in Electrical, Electronics, or a related engineering discipline. 10+ years of IC package design experience. Expertise in WLCSP, BGA, FCCSP, SiP, QFN/DFN, and leadframe-based package technologies. Proficiency in Cadence APD/SIP and AutoCAD. Strong understanding of package design, including complex structures, and manufacturability. Excellent communication and teamwork skills. Experience working with OSATs and global cross-functional teams. Good-to-Have Qualifications: Experience with Cadence Sigrity and/or Ansys tools. Knowledge of electrical modeling and simulation. Familiarity with SI/PI analysis and package optimization. Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .