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发布于 2026-09-23 英文原文

首席测试工程师

Principal Test Engineer

ルネサス エレクトロニクス

职种工程 雇用形态—
工作地点Bengaluru, KA, in 薪资面议

职位概要

Renesas(瑞萨电子)是一家全球半导体公司,为汽车、工业、基础设施、数据中心和智能家居等先进应用提供硬件和软件解决方案。IFI(India for India)组织现招聘首席测试工程师,负责从概念到量产及持续支持阶段,为新半导体产品定义并交付稳健、高性价比的量产测试方案。主要职责包括:制定生产测试策略和制造测试流程(含测试机选型);主导测试计划,在流片前为DFT、DFM和设计评审提供可测试性输入;定义涵盖ATE实施的详细测试计划;主导测试硬件需求与开发(负载板、探针卡、插座、接口硬件及夹具);开发并评审ATE测试程序、测试方法、生产图形及配套软件;主导首次硅片ATE上电、测试程序调试和样品生成;按产品表征计划执行跨工艺、电压和温度的ATE表征;开发专用测试程序支持认证和客户样品生成;识别测试覆盖缺口和潜在逃逸,实施遏制和永久纠正措施;将合格的测试软硬件发布到生产并支持OSAT制造启动;评审并签署测试交付物;推动量产爬坡准备评审并消除测试相关发布风险;通过方法优化、改进排序、多工位效率和仪器利用率降低测试时间;支持客户退货和RMA调查。技术领导方面需提供技术方向、签署评审、在设计、产品工程、运营、供应商和OSAT团队间主导技术决策和风险解决(含DFX议题),需完全独立并被认可为领域专家,能在无直接职权下影响跨职能团队并清晰沟通。任职资格:电子工程、电气工程或相关专业学士或硕士学位;至少15年相关半导体测试工程经验,涵盖NPI、表征、认证、量产发布和持续支持;精通半导体生产测试方法并具备开发ATE测试方案的实践经验;熟悉Teradyne J750HD、Advantest V93000或同等ATE平台;具备SoC、MCU产品量产测试方案开发经验;具备测试硬件开发经验(负载板、探针卡、插座及handler/prober接口);较强的编程能力;具备在OSAT推动制造发布的经验;熟悉JMP、PDF Exensio、Python等等数据分析与良率管理工具;较强的分析、技术领导、计划、沟通和问题解决能力。Renesas文化以TAGIE为核心,即透明、敏捷、全球、创新和创业精神,提供有竞争力的薪酬福利。

职位描述

Company Description Renesas is a global semiconductor company providing hardware and software solutions for advanced automotive, industrial, infrastructure, data-centre and smart-home applications. We are a dynamic, multicultural technology company where employees learn, mentor, innovate and thrive while helping shape what is next in electronics. Job Description IFI (India for India) organization is seeking a Principal Test Engineer to define and deliver robust, cost-effective production test solutions for new semiconductor products from concept through mass production and sustaining support. In this lead role, the principal test engineer owns the test strategy, ATE test development, test hardware, test validation, qualification and production release, test-cost optimization and industrial activities. Key Responsibilities Define the production test strategy and manufacturing test flow for assigned products including tester selection Own the test planning Provide testability input to DFT, DFM and design reviews before tapeout Define detailed test plan covering ATE implementation Lead test hardware requirements and development, including loadboards, probe cards, sockets, interface hardware and related fixtures. Develop and review ATE test programs, test methods, production patterns and supporting software. Lead first-silicon ATE bring-up, test program debug and sample generation. Execute ATE characterization across process, voltage and temperature conditions in alignment with the product characterization plan. Support qualification and customer sample generation by developing dedicated test programs Identify test coverage gaps and potential escapes, then implement containment and permanent corrective actions Release qualified test software and hardware into production and support OSAT manufacturing start-up. Review and sign off test deliverables Drive production ramp readiness reviews and close test-related release risks. Reduce test time through method optimization, improved sequencing, multisite efficiency and instrumentation utilization. Support customer-return and RMA investigations by reproducing failures and assessing production test coverage. Technical Leadership Provide technical direction, sign off reviews Lead technical decisions and risk resolution across Design, Product Engineering, Operations, suppliers and OSAT teams including DFX topics Fully independent and recognized as subject-matter-expert Influence cross-functional teams without direct authority and communicate clearly to the stakeholders. Qualifications Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering or a related discipline. At least 15 years of relevant semiconductor test engineering experience spanning NPI, characterization, qualification, production release and sustaining support. Strong knowledge of semiconductor production test methodologies and practical experience developing ATE test solutions. Experience with Teradyne J750HD, Advantest V93000 or equivalent ATE platforms. Experience developing production test solutions for SoC, MCU products Experience with test hardware development, including loadboards, probe cards, sockets and handler/prober interfaces. Strong programming skills Experience driving manufacturing release at OSATs Experience with data-analysis and yield-management tools such as JMP, PDF Exensio, Python or equivalent platforms. Strong analytical, technical leadership, planning, communication and problem-solving skills. Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .