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发布于 2026-10-21 英文原文

持续产品工程高级经理

DEPARTMENT MANAGER (DESIGN)

ルネサス エレクトロニクス

职种工程 雇用形态—
工作地点Taipei, tw 薪资面议

职位概要

该职位为持续产品工程高级经理,领导产品工程师团队,负责已量产的晶圆/代工产品及功率模块在高量产中的健康状态,覆盖晶圆制造、模块组装和生产测试全流程,推动制造稳定及良率、质量、成本持续改善。向产品与测试持续工程总监汇报,并与测试工程、运营、质量、可靠性及代工和OSAT/组装伙伴协作。核心期望是以数据早期发现问题、定位根因并推动及时行动,建立覆盖晶圆、组装、测试的持续产品健康监控数据驱动文化。职责包括:领导团队解决良率异常、测试逃逸和可靠性问题,推动8D、5Why根因分析与闭环纠正;与质量和运营合作处理客户退货和现场可靠性;监控良率、DPPM、测试成本、周期时间等KPI;建立产品健康仪表盘和阈值;运用SPC、参数趋势和跨工序相关性提前发现漂移;将数据转化为按良率、成本和风险量化的优先级行动;定期与运营、质量、测试及伙伴开展数据评审并跟踪闭环;推动数据采集分析自动化及现代分析工具规模化;辅导工程师应用分析并清晰沟通。还负责通过数据分析、SPC、参数监控和缺陷减少提升良率,区分测试与工艺/组装良率损失,通过测试时间缩短、多工位优化和报废减少降本;负责晶圆分选和模块终测的产品侧执行,包括测试覆盖、保护带、限值和逃逸预防,与测试工程合作完成ATE平台转换及OSAT和内部站点测试单元认证;作为代工、组装和测试伙伴的技术接口,支持新增产线、站点和工具认证放量;与可靠性团队合作模块认证与监控,负责PCN、ECO和制造转移,支持EOL和最后一次采购;建设、辅导和发展跨站点跨区域高绩效团队,推动标准化和最佳实践共享,支持总监进行人头、预算和路线图规划。要求电气工程或相关学士(硕士优先),10年以上半导体产品工程、测试工程或制造经验,其中至少5年领导高量产团队,具备多站点/多区域团队管理和跨职能无直接授权协作经验,能用数据分析(SPC、良率与参数分析、趋势与相关性分析)识别问题并推动可衡量改善和纠正措施闭环,熟悉ATE和生产测试方法、良率分析、失效分析和根因方法,了解晶圆厂、组装/封装和测试流程,有OSAT、外部制造商和ATE/设备供应商合作经验。优先:功率模块或功率封装(IGBT/SiC/GaN模块、功率级、PMIC)经验,模块组装工艺和失效模式实操知识,代工接口和晶圆参数数据经验,熟练使用JMP、Spotfire、Python/SQL、Power BI/Tableau等分析工具并构建仪表盘或自动监控,测试转换和ATE平台策略经验,PCN/ECO流程、SPC和数据分析系统及自动化经验,熟悉汽车、工业或数据中心功率可靠性要求。

职位描述

Job Description About the job The Senior Manager of Sustaining Product Engineering leads product engineers responsible for the health of released wafer/foundry-based products and power modules in high-volume production. The role covers the full flow: wafer fab, module assembly, and production test. It drives stable manufacturing and continuous yield, quality, and cost improvement. It reports to the Director of Product and Test Sustaining Engineering and partners with Test Engineering, Operations, Quality, Reliability, and foundry and OSAT/assembly partners. A defining expectation of this role is using data to detect problems early, identify root causes, and drive timely action. The leader builds a data-driven culture in which product health is monitored continuously across wafer, assembly, and test rather than reviewed after the fact. Job Description Product Health & Issue Resolution Lead sustaining product engineers in resolving production issues across wafer, module assembly, and test, including yield excursions, test escapes, and reliability concerns. Drive root cause analysis and closed-loop corrective actions (8D, 5-Why). Partner with Quality and Operations on customer returns and field reliability issues. Monitor product KPIs (yield, DPPM, test cost, cycle time) and drive corrective actions. Data-Driven Monitoring & Action Establish and own product health dashboards and KPIs (yield, DPPM, test cost, cycle time, scrap, return rates) across wafer, assembly, and test, with clear thresholds and owners. Use SPC, parametric trends, and cross-process correlation (wafer sort to module final test to returns) to detect excursions and drift before they affect customers or supply. Turn data into decisions: prioritize the highest-impact issues by quantified yield, cost, and risk, and drive each to owned, time-bound corrective actions. Run regular data-driven reviews with Operations, Quality, Test, and partners, enforcing action tracking and closure. Challenge conclusions with data, including partner-reported data, and require evidence of root cause and effectiveness of corrective actions. Drive automation of data collection and analysis, and use modern analytics tools to scale across product lines. Coach engineers to apply analytics and to communicate data-based findings clearly to leadership. Yield Improvement & Cost Optimization Drive yield improvement through data analytics, SPC, parametric monitoring, and defect reduction across wafer, assembly (die attach/sinter, wire/clip bond, molding, substrate), and test. Use test data and correlation to separate test-related from process- or assembly-related yield loss. Deliver cost reduction through test time reduction, multisite optimization, and scrap reduction. Production Test Execution Own product-side execution of production test for wafer sort and module final test, including test coverage, guardbands, limits, and escape prevention. Partner with Test Engineering on test conversions across ATE platforms, ensuring correlation, stability, and scalability in manufacturing. Support hardware/software transitions (testers, handlers, load boards, test programs) and test cell qualification at OSATs and internal sites. Drive test cost optimization with automation and SPC. Foundry, OSAT & Assembly Partner Management Serve as the technical interface to foundry, assembly, and test partners for sustaining issues, process excursions, performance reviews, and corrective actions. Support qualification and release of additional lines, sites, and tools, ensuring readiness for high-volume production. Partner with Operations on demand/capacity balancing and risk mitigation. Reliability & Change Management Work with Reliability on module qualification and monitoring (power cycling, thermal cycling, HTRB). Own PCNs, ECOs, and manufacturing transfers, including assembly material and process changes, with minimal production disruption. Support EOL and last-time-buy activities. Team Leadership Build, mentor, and develop a high-performing sustaining product engineering team across sites and regions. Drive standardization, best-known methods, and lessons-learned sharing across product lines and factories. Support the Director on headcount, budget, and roadmap planning. Qualifications Required Bachelor’s degree in Electrical Engineering or related field (Master’s preferred). 10+ years of semiconductor experience in Product Engineering, Test Engineering, or Manufacturing, with at least 5 years leading teams in high-volume production. Experience managing multi-site or multi-region teams and working cross-functionally without direct authority. Demonstrated ability to use data analytics (SPC, yield and parametric analysis, trend and correlation analysis) to identify issues and drive measurable improvements and closure of corrective actions. Strong working knowledge of ATE and production test methodologies, and of yield analysis, failure analysis, and root cause methods. Understanding of wafer fab, assembly/packaging, and test flows. Experience working with OSATs, external manufacturers, and ATE/equipment suppliers. Preferred Experience with power modules or power packaging (IGBT/SiC/GaN modules, power stages, PMICs). Hands-on knowledge of module assembly processes and failure modes. Experience with foundry interfaces and wafer parametric data. Proficiency with data analysis tools and platforms (e.g., JMP, Spotfire, Python/SQL, Power BI/Tableau) and experience building dashboards or automated monitoring. Experience with test conversions and ATE platform strategy. Experience with PCN/ECO processes, SPC and data analytics systems, and automation. Familiarity with automotive, industrial, or data center power reliability requirements. Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .