AI/数据中心基础设施电源封装工程与新产品导入项目经理

Job Description Own the execution of Renesas’ strategic AI/Datacenter Infrastructure Power package engineering and New Product Introduction (NPI) programs, from development and qualification through production ramp, in a fast-paced, high-growth environment. You will collaborate with product Technical Program Managers (TPMs) and personnel embedded at key global OSATs, to deliver committed schedules and quality, reliability, and production-readiness objectives. You will partner closely with Package Engineering leadership, Power product group teams, and OSAT/CM partners, escalating critical risks early and leading cross-functional technical task forces on issues that threaten quality, reliability, yield, manufacturability, cost, or schedule. KEY RESPONSIBILITIES Lead Technical Program Management execution for strategic AI/Datacenter Infrastructure Power NPI and package engineering programs, directly managing complex programs as needed. Partner with Package Engineering Directors and technical leads, providing program-level execution leadership, governance, and accountability while keeping technical ownership clear and unduplicated. Establish and drive end-to-end NPI program plans, milestones, critical paths, and resource alignment to achieve committed schedules. Establish a disciplined program management operating model covering development, qualification, customer requirements, production readiness, ramp, and transition to volume manufacturing. Continuously improve standardized processes, templates, metrics, escalation mechanisms, and lessons-learned practices, and drive consistent execution standards across internal teams and strategic OSAT locations. Proactively identify technical, quality, reliability, supply, manufacturing, and schedule risks and establish mitigation plans. Escalate critical issues with clear recommendations and decision points. Lead cross-functional technical task forces, collaborating closely with internal teams and external partners (OSAT/CM, customers), on issues that threaten quality, reliability, yield, manufacturability, qualification, schedule, or customer commitments, including process-integration and assembly problems. Drive root-cause analysis and data-based decisions, and hold corrective/preventive actions through to closure. Coordinate closely with Power product group partners (Design, Application, Marketing), Product Engineering, Reliability, Quality, Operations, and Supply Chain to remove execution barriers and maintain program momentum. Establish program dashboards and management systems giving transparent visibility into milestones, critical path, risks, issues, action owners, and recovery plans. Collaborate and drive key OSAT/CM partners through program reviews, milestone tracking, issue escalation, and recovery plans. Ensure Engineering Build Requests (EBRs) are executed on committed schedule at each OSAT, tracking progress, identifying delays, and driving recovery actions. Align OSAT/CM development activities (DOE, process optimization, process-window verification, production controls) and qualification and ramp readiness with overall NPI program objectives.. Build strong working relationships with OSAT/CM executive and technical leadership to improve responsiveness, accountability, and execution of critical AI/Datacenter Power programs. Ensure effective transition from development and qualification into production through readiness reviews, ramp monitoring, and issue management. Provide concise, fact-based communication to directors and senior leadership on program health, critical risks, schedule recovery, resource needs, and decisions required. Support package technology roadmap execution by translating strategic priorities into executable programs, milestones, resources, and deliverables. LEADERSHIP & ORGANIZATIONAL RESPONSIBILITIES Translate organizational priorities into team objectives, staffing recommendations, performance expectations, and development plans. Foster a culture of urgency, fact-based decision making, cross-functional collaboration, ownership, and rapid issue resolution. Qualifications Bachelor’s degree or higher in Electrical, Mechanical, Chemical, or Materials Engineering; Materials Science; Physics; Chemistry; or a related technical discipline. 12+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field, including experience leading complex cross-functional programs. Demonstrated experience managing complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp. Strong understanding of semiconductor product development process, package and assembly processes. Hands-on experience in Power Management products, particularly with several of these: power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management system, PMICs, wafer-level and/or flip-chip technologies. Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations. Proven track record leading cross-functional technical task forces and resolving complex issues involving quality, reliability, yield, manufacturability, and schedule. Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies. Strong program management skills, including critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment. Strong interpersonal, communication, negotiation, and presentation skills, including the ability to communicate effectively with senior leaders. Ability to influence technical and business leaders without direct authority and drive accountability across organizational boundaries. Strong analytical skills and ability to translate complex technical issues into clear business impact, decisions, and actions. Willingness to travel domestically and/or internationally approximately 10–20% of the time, including to OSAT/CM sites. PREFERRED QUALIFICATIONS Experience supporting high-growth, high-visibility customer programs. Familiarity with wide-bandgap (SiC/GaN) devices, power-module substrates (DBC/AMB), multi-chip, or advanced interconnect technologies Experience with formal technical program management methodologies and portfolio-level governance. Experience driving customer-critical NPI programs in a fast-paced, high-growth environment. SUCCESS MEASURES On-time achievement of NPI milestones and customer commitments. Reduction in schedule delays caused by unresolved technical, quality, reliability, or manufacturing issues. Timely closure of critical cross-functional task-force actions. Improved qualification, yield, reliability, and production-readiness performance. Effective execution and alignment of strategic OSAT/CM partners. Additional Information Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources. Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier,