高级封装NPI主任工程师

Company Description The Senior Packaging NPI Staff Engineer is responsible for leading Wafer-Level Chip-Scale Package (WLCSP) new product introduction activities from development through volume production. This role serves as the primary technical and program interface to customers, while coordinating cross-functional global teams to ensure successful execution of schedule, cost, quality, reliability, and cost objectives. The position requires deep WLCSP technical expertise, strong customer-facing communication skills, and demonstrated experience in board-level reliability evaluation and failure analysis to support customer qualification and risk assessment. Job Description NPI, Reliability & Technical Leadership Own WLCSP package and process readiness from development through mass production. Define and control assembly flow, critical process parameters, materials, and reliability risks. Serve as final technical authority for WLCSP-related decisions impacting quality, yield, cost, and reliability. Board Level Reliability (BLR) & Failure Analysis Leadership Own BLR test strategy definition, execution alignment, and technical interpretation. Lead failure mechanism identification, root cause analysis, and corrective action definition. Correlate package design, material properties, process variables, and PCB interactions to BLR performance. Customer Technical Interface & Program Leadership Act as primary customer-facing technical lead for WLCSP NPI and reliability topics. Host and lead customer technical reviews, BLR updates, and issue resolution meetings. Ensure customer confidence through clear communication, data-driven analysis, and timely follow-up. Cross-Functional & Global Team Coordination Coordinate global, cross-functional teams across engineering, QA, manufacturing, and supply chain. Drive alignment on schedule, deliverables, risk mitigation, and action closure. Escalate issues appropriately and facilitate resolution across organizational boundaries Continuous Improvement & Knowledge Leadership Drive process optimization, yield improvement, and reliability enhancement initiatives. Capture and disseminate best practices, lessons learned, and technical standards. Mentor engineers and elevate overall WLCSP technical capability. Qualifications Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field. Typically 10+ years of experience in semiconductor packaging, with strong focus on WLCSP and board-level reliability. Prior experience in NPI, package engineering, or customer-facing technical roles preferred. Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .