FCBGA/WLCSP封装工艺首席工程师

Job Description We are seeking an experienced back-end assembly engineer specializing in FCBGA and WLCSP, including support for the R-CAR series, one of Renesas’ key automotive product lines. The successful candidate will initially take primary technical responsibility for FCBGA/WLCSP products manufactured at both domestic and overseas internal manufacturing sites and OSATs. In the future, the scope of responsibility is expected to expand to cover a broader range of flip-chip package technologies, including Chiplet packages. As a significant portion of the products are manufactured by overseas OSATs, we expect the candidate to take a proactive approach to communication and collaboration in both Japanese and English. We are ideally looking for an experienced professional who can make an immediate contribution. At the same time, strong support will be available from the experienced direct manager, and we welcome someone who is motivated to contribute to the team and continue growing together with us. Lead Assembly Process Engineer for FCBGA/WLCSP, responsible for assembly engineering from development through mass production. Development: Technical verification and review of development results. Mass Production: Assembly yield, cost, and quality improvement activities; management of product/process changes; and coordination with relevant functions. Issue Resolution: Development and technical review of root cause and corrective actions; coordination with Quality Assurance; and customer support. ​​​*The full details regarding your position scope as well as any future potential changes in work location and job scope will be provided during the interview process. Qualifications 【MUST】 Business-level communication skills in Japanese and conversational skills in English for daily communication (TOEIC score of approximately 600). Basic knowledge of semiconductor back-end processes. Relevant work experience in the following areas: Yield/quality/cost improvement related to Assembly process. Troubleshooting and issue resolution related to Assembly process. 【WANT】 Hands-on experience in the following areas: Yield/quality/cost improvement for FCBGA. Yield/quality/cost improvement for WLCSP. Yield/quality/cost improvement for Assembly processes. Troubleshooting and issue resolution for Assembly processes. Coordination with overseas subcontractors/OSATs. Additional Information ルネサスは、「To Make Our Lives Easier（人々の暮らしをより豊かで快適にする）」というPurposeのもと、組込み半導体ソリューションを提供するグローバル企業です。世界30か国以上で活躍する21,000人を超えるエンジニアや課題解決のプロフェッショナルとともに、自動車、産業、インフラ、IoT分野における世界最先端のテクノロジー開発に携わり、より安全で、健康的で、環境にやさしく、スマートな未来の実現に貢献しています。 ルネサスでは、「TAGIE（Transparent、Agile、Global、Innovative、Entrepreneurial）」を企業文化の中核としています。TAGIEは、私たちの働き方や成長のあり方、そしてPurposeの実現に向けた取り組みを支える共通の価値観です。この協調的な精神と挑戦するマインドセットが、半導体技術を通じた産業の変革と、世界中の人々の暮らしへの貢献を可能にしています。 私たちは、競争力のある報酬制度に加え、充実した福利厚生をご用意しています。福利厚生の詳細については、選考プロセスの中でご案内いたします。 私たちとともに未来を創造する挑戦に、ぜひ参加しませんか。皆さまからのご応募をお待ちしております。