发布于 2026-10-16
英文原文
高级主任封装设计工程师
Sr Staff Package Design Engineer
ルネサス エレクトロニクス
| 职种 | 工程 | 雇用形态 | — |
|---|---|---|---|
| 工作地点 | Bayan Lepas, my | 薪资 | 面议 |
职位概要
该职位为高级主任封装设计工程师,负责管理OSAT(外包组装与测试分包商)的后端半导体制造流程与活动,作为Renesas与OSAT之间的主要技术接口。主要职责包括:管理OSAT以实现良好的良率、质量、交付和成本绩效,推动改进活动以达成KPI;与跨职能团队(NPI、供应链、质量)协作,参与新封装/新产品或现有产品更换供应商/OSAT或工艺/材料变更的认证活动,确保顺利过渡到量产;建立并执行工艺标准,确保一致性和法规合规性;与生产、质量保证和供应链团队紧密合作解决技术问题,推动卓越运营;主导或参与根本原因分析和纠正措施实施;支持内部审计和客户审计并回应审计发现。优先考虑具有汽车产品经验者。任职资格:工程、科学或同等领域学士学位;至少10年半导体制造与工艺工程经验;熟悉精益制造原则及其他持续改进方法;具备项目管理、六西格玛或AutoCAD软件知识者优先;优秀的沟通能力,能在跨职能团队中有效工作;自我驱动,能在高级管理层期望下自我监督。Renesas提供具有竞争力的薪酬福利,致力于多元化和包容性,是平等机会雇主。
职位描述
Job Description Job Summary Senior Staff Package Design Engineer overseas the Backend Semiconductor manufacturing processes and activities at OSATs. Be the primary technical interface between Renesas and OSATs. Note: OSAT – Outsourcing Subcontractor Assembly & Test Key Responsibilities Managing OSAT towards good yield, quality, delivery, cost performance and drive improvement activities to meet KPI. Collaborate with cross-functional teams (NPI, Supply Chain, Quality) on new packages/products, or existing products but alternate supplier/OSAT, or process/materials’ changes with qualification activities & towards seamless release transition to production. Establish and enforce process standards to ensure consistency and compliance with regulatory requirements. Work closely with Production, Quality Assurance, and Supply Chain teams to resolve technical issues and drive operational excellence. Lead or participate in root cause analysis and corrective action implementation for process-related issues. Support internal audit and customer audit, and respond on audit findings Prefer with automotive products experience Qualifications Bachelor’s degree in engineering, Science or equivalent field Minimum 10 years of experience in Semiconductor Manufacturing & Process Engineering Experience with Lean manufacturing principles and other continuous improvement methodologies. Knowledge of Project Management, Six Sigma or AutoCAD software will be good to have Excellent communication skills and ability to work effectively in cross-functional teams Self-starter and self-supervising within the expectations of senior management Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .