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发布于 2026-11-03 英文原文

高级产品经理 - 服务器平台管理MCU解决方案

Senior Staff Engineer, Product Marketing (AI datacenter infrastructure)

ルネサス エレクトロニクス

职种产品 雇用形态—
工作地点San Jose, CALIFORNIA, us 薪资该职位的预期年薪范围为180,000美元至223,000美元。该职位还有资格获得奖金机会。

职位概要

该高级职位结合数据中心服务器系统专业知识与基于MCU的平台管理及控制平面解决方案的产品定义和营销。候选人需理解服务器主板、CPU及GPU/AI加速器托盘、存储背板、电源系统和冷却子系统如何被监控和控制。重点在于分布式管理控制器、卫星控制器和板管理MCU,它们与基板管理控制器(BMC)协同工作而非替代BMC。需与超大规模厂商、服务器OEM、ODM及生态伙伴合作,将系统需求转化为差异化芯片、固件、参考解决方案、商业案例、路线图和上市计划。任职要求:电气工程、计算机工程、计算机科学或相关领域学士及以上学位,8年以上相关经验;具备系统架构、服务器平台管理、嵌入式系统、半导体产品定义、技术产品管理或应用工程经验;深入了解服务器主板、CPU/GPU/AI加速器平台、存储背板及电源和冷却子系统及其管理接口和控制器划分;理解基于BMC的带外管理、卫星管理控制器、MCU/RTOS固件及本地实时控制与系统级管理的边界;熟悉MCTP传输、基于PLDM的监控/控制和固件更新、SPDM认证和测量交换,以及设备管理与BMC托管的Redfish服务的集成;熟悉I2C/SMBus、I3C、SPI、UART、GPIO和PMBus等服务器边带接口及其对连接性、延迟、可靠性和MCU需求的影响;能够创建产品需求、商业案例、路线图和上市计划;具备与高管、技术、客户和跨职能受众沟通的强沟通能力。优先条件:具有超大规模或企业服务器、GPU/AI加速器托盘、机架管理、电源架、风扇控制器或液冷管理经验;实际接触OpenBMC集成、OCP DC-SCM/DC-SCI或模块化服务器架构及MCTP/PLDM/SPDM端点互操作性测试;具有定义安全、软件使能控制器(安全启动、硬件信任根、设备身份、签名固件更新、恢复、SDK和参考设计)的经验;具有服务器启动、电源时序、遥测和故障诊断、固件生命周期管理或涉及超大规模厂商、OEM/ODM和BMC生态伙伴的客户设计导入经验;工程或商业高级学位或同等高级产品战略经验。职责包括:产品定义——定义服务器平台管理、卫星控制器及跨计算、加速器、存储、电源和冷却子系统的分布式控制的MCU需求;将客户和市场输入转化为MRD、商业案例、路线图提案和投资优先级;定义机架级监控和控制、板级管理、电源时序、复位控制、传感器聚合、遥测、热管理、功率封顶、故障报告和恢复的用例;定义完整解决方案:芯片、嵌入式固件、管理协议栈、SDK、工具/GUI、参考设计及客户特定工具和应用层。客户和市场发现——领导与超大规模平台团队、服务器OEM/ODM、BMC和固件供应商、加速器平台团队及电源和冷却伙伴的技术发现;映射服务器和机架管理架构、控制器放置、边带连接、固件归属及可用性、可服务性、安全性和生命周期管理需求;评估竞争对手和替代方案;将洞察转化为差异化定位和路线图选择;跟踪相关OCP倡议(包括DC-SCM/DC-SCI)和DMTF管理标准(包括MCTP、PLDM、SPDM和Redfish),将其影响转化为产品和互操作性需求。产品营销和上市——创建定位、信息传递、发布计划、销售赋能、客户演示和竞争简报;将Renesas MCU定位为BMC companion和卫星控制器解决方案,实现安全、可互操作的平台管理,与通用MCU和BMC SoC明确区分;将产品能力与客户用例、生态标准、参考设计和商业价值连接;支持销售、现场应用和客户工程团队的设计导入活动。跨职能执行——协调产品线、架构、芯片、软件、应用、销售和战略客户团队;平衡市场机会、技术可行性、开发投资和商业回报;领导产品概念、商业案例、路线图选择、发布准备和客户优先级评审;使芯片和固件计划与客户平台时间表、BMC集成、协议互操作性、参考设计验证和部署支持保持一致。

职位描述

Job Description This senior role combines datacenter server-system expertise with product definition and marketing for MCU-based platform-management and control-plane solutions. The candidate will understand how server motherboards, CPU and GPU/AI accelerator trays, storage backplanes, power systems, and cooling subsystems are monitored and controlled. The focus is distributed management controllers, satellite controllers, and board-management MCUs that work alongside the baseboard management controller (BMC), rather than a replacement for the BMC itself. Working with hyperscalers, server OEMs, ODMs, and ecosystem partners, the candidate will translate system requirements into differentiated silicon, firmware, reference solutions, business cases, roadmaps, and go-to-market plans. Qualifications Bachelor’s degree or higher in electrical engineering, computer engineering, computer science, or related field with 8+ years of relevant experience. Experience in system architecture, server platform management, embedded systems, semiconductor product definition, technical product management, or applications engineering. Strong system knowledge of server motherboards, CPU/GPU/AI accelerator platforms, storage backplanes, and power and cooling subsystems, including their management interfaces and controller partitioning. Strong understanding of BMC-based out-of-band management, satellite management controllers, MCU/RTOS firmware, and the boundary between local real-time control and system-level management. Working knowledge of MCTP transport, PLDM-based monitoring/control and firmware update, SPDM authentication and measurement exchange, and how device management integrates with BMC-hosted Redfish services. Familiarity with server sideband interfaces such as I2C/SMBus, I3C, SPI, UART, GPIO, and PMBus, and their implications for connectivity, latency, reliability, and MCU requirements. Ability to create product requirements, business cases, roadmaps, and go-to-market plans. Strong communication skills with executive, technical, customer, and cross-functional audiences. Preferred: Experience with hyperscaler or enterprise servers, GPU/AI accelerator trays, rack management, power shelves, fan controllers, or liquid-cooling management. Practical exposure to OpenBMC integration, OCP DC-SCM/DC-SCI or modular server architectures, and interoperability testing of MCTP/PLDM/SPDM endpoints. Experience defining secure, software-enabled controllers with secure boot, hardware root of trust, device identity, signed firmware updates, recovery, SDKs, and reference designs. Experience with server bring-up, power sequencing, telemetry and fault diagnostics, firmware lifecycle management, or customer design-ins involving hyperscalers, OEMs/ODMs, and BMC ecosystem partners. Advanced degree in engineering or business, or equivalent senior product strategy experience. Product definition: Define MCU requirements for server platform management, satellite controllers, and distributed control across compute, accelerator, storage, power, and cooling subsystems. Translate customer and market input into MRDs, business cases, roadmap proposals, and investment priorities. Define use cases for rack-level monitoring and control, board housekeeping, power sequencing, reset control, sensor aggregation, telemetry, thermal management, power capping, fault reporting, and recovery. Define the complete solution: silicon, embedded firmware, management-protocol stacks, SDKs, tools/GUIs, reference designs, and customer-specific tools and application layer. Customer and market discovery: Lead technical discovery with hyperscaler platform teams, server OEMs/ODMs, BMC and firmware vendors, accelerator platform teams, and power and cooling partners. Map server and rack management architectures, controller placement, sideband connectivity, firmware ownership, and requirements for availability, serviceability, security, and lifecycle management. Assess competitors and alternatives; convert insights into differentiated positioning and roadmap choices. Track relevant Open Compute Project (OCP) initiatives, including DC-SCM/DC-SCI, and DMTF management standards including MCTP, PLDM, SPDM, and Redfish; translate their implications into product and interoperability requirements. Product marketing and go-to-market: Create positioning, messaging, launch plans, sales enablement, customer presentations, and competitive briefs. Position Renesas MCUs as BMC companion and satellite-controller solutions for secure, interoperable platform management, with clear differentiation from general-purpose MCUs and BMC SoCs. Connect product capabilities to customer use cases, ecosystem standards, reference designs, and business value. Support design-in activity with sales, field applications, and customer engineering teams. Align product line, architecture, silicon, software, applications, sales, and strategic customer teams. Balance market opportunity, technical feasibility, development investment, and commercial return. Lead reviews for product concepts, business cases, roadmap choices, launch readiness, and customer priorities. Align silicon and firmware plans with customer platform schedules, BMC integration, protocol interoperability, reference-design validation, and deployment support. Cross-functional execution: Align product line, architecture, silicon, software, applications, sales, and strategic customer teams. Balance market opportunity, technical feasibility, development investment, and commercial return. Lead reviews for product concepts, business cases, roadmap choices, launch readiness, and customer priorities. Align silicon and firmware plans with customer platform schedules, BMC integration, protocol interoperability, reference-design validation, and deployment support. Additional Information Pay Transparency The expected annual pay range for this position is $180,000 - $223,000. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate. Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance. In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation. New employees will attend a detailed benefit orientation to learn more about our many benefits and resources. Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity &